Suspect iPhone 7 Leak Could Actually be True

Whenever Apple develops a new product, there’s usually various leaks and theories about the company’s future direction. This is especially when case when the latest iPhone is upon us and creates a media frenzy. Often, the leaked designs are innovative renders which are simply not possible to produce on a mass scale. Recently, a leaked image claimed to show the rear unibody of Apple’s upcoming iPhone 7 handset. The image was rightfully met with scepticism because the three dots near the bottom look like a Smart Connector. According to the reliable Japanese Apple blog MacOtakara, which was reported by MacRumors,  “the possibility is great” that both the image of the iPhone 7 Plus housing and the design sourced from Catcher are “the real thing.”

The images also suggest that there won’t be a huge difference in the device’s form factor compared to current offerings with the iPhone 6s and iPhone 6s Plus. Previous rumours have hinted at Apple’s plans to remove the headphone jack and introduce dual stereo speakers. The source goes into detail about the possibility of two new sensors positioned at the top of the device. It’s uncertain what these will do but it could revolve around adjusting ambient lighting based on an environment’s temperature. Another consistently reported rumour is the introduction of dual cameras on both the iPhone 7 and iPhone 7 Plus.

Clearly, it’s difficult to deduce if the leaked image is authentic, but MacOtakara has a reputable history when disclosing details about upcoming Apple products. As the release date dawns nearer, more rumours from multiple sources should appear. If the widespread report regarding the lack of a headphone jack is true, I’m really interested to see the reaction among consumers. Apple probably perceives this is a bold, revolutionary step to streamline the iPhone’s design. However, this surely is coming at the expense of basic functionality.

More iPhone 7 Details

Every year we see another selection of technology released, sometimes contain new technologies and sometimes old technologies are continued into the next selection of hardware released. One market that keeps moving forward is the mobile market and Apple looks to continue with its iPhone 7. With rumours about it being waterproof spreading, it was only a matter of time before we got more iPhone 7 details, something we now have.

A source that is said to have had knowledge of the plans detailed several features that have long been rumoured. The big one will be that the iPhone 7 will come without the standard 3.5mm headphone jack and will instead use a propriety headphone jack built into the lightning port and created in collaboration with Wolfson Microelectronics. With rumours flying around since their patent application for the new headphone connection, the new system is said to feature noise-cancelling technology created by Wolfson Microelectronics both within the phone and the headphones themselves in order to help reduce background noise. The source continued to say that other companies would need to buy a licence to use the technology within their own models.

The source states that they are also putting in wireless charging technology (after considering it in their last two iPhones) into the iPhone 7, alongside the new waterproof status that its said to carry.

While it is still several months before the phone begins production, many iPhone users will no doubt worry about the need to buy expensive headphones or an adapter in order to listen to music on their iPhone without wireless headphones.

iPhone 7 to Feature Innovative new Intel LTE Chip

A new report suggests that the new Apple handset, the iPhone 7, is set to feature the Intel 7360LTD modem chip, which doesn’t sound terribly exciting, but given that it’s also reported that Intel already has 1,000 employees working on the brand new hardware for the upcoming handset, it should be pretty special.

The new LTE chip is set to give the next-gen Apple handset a hefty speed boost, offering much faster wireless speeds that I’m sure any user of the device will welcome. The new chip is said to be capable of up to 450Mb/s downlink, will support an impressive 29 LTD bands, meaning that using the phone virtually anywhere in the world shouldn’t be an issue, with all major 4G LTE bands supported.

“Sources with knowledge of the situation say that Apple eventually would like to create a system-on-a-chip (SOC) that includes both the phone’s Ax processor and the LTE modem chip. A system-on-a-chip design could deliver significant returns in improved speed and better power management.” said Venturebeat

If this works out, a partnership between Intel and Apple could be very lucrative and could open up a lot of possibilities for both companies in the future. Of course, Apple is sticking with the LTE chip for now, as the iPhone 7 is expected the run on the new 10nm A10 chip.