In Win 805 Aluminium and Glass Mid-Tower Chassis Review

Introduction


In Win, the modern masters of chassis design, are back once again. Today we’ll be taking a look at the In Win 805, a slightly more accessible product for the masses that takes many of the style points of the premium ranges that In Win offer. We’ve been blown away by their more creative products such as the S-Frame, H-Frame, H-Tower, D-Frame, Tao and many more, but it is nice to see these wonder-chassis filtering down into a more consumer friendly package, both in terms of price and ergonomics.

The 805 is designed to impress, with an aluminum frame which features LED highlighting, as well as glass panels on the left, front and right sides, giving you a great look at the chassis interior, perfect for showing off your build. There are three colours available, which colour coordinate the front I/O panel with the LED In Win logo on the side of the chassis.

No stranger to innovation, the chassis also features the new USB3.1 Type-C connector.

“805 is equipped with one all-new reversible USB3.1 TYPE-C port for ultimate data speed transfers up to 10Gb/s which is twice as fast USB 3.0*. This feature saves valuable transfer time and also the USB3.1 TYPE-C is easily accessible at both ends. The actual data transfer speeds will be determined by your motherboard specification.

Water cooling or air cooling, the 805 has got you covered here too. There’s a single 120mm exhaust fan included, but you’ll find room for two 120mm fans in the base, as well as two 120/140mm fans in the front. This also means you can fit a radiator in the front and back of the chassis, allowing you to unlock more performance and cooling for your hardware of choice.

First impression of this chassis are extremely positive, with a full-size side-panel cut from tempered glass that looks significantly better than any plastic panel ever would. The panel is held on by four aluminium thumb screws and mounted on rubber coated pegs to protect it.

The right side panel is the same, giving a great view of the interior and behind the motherboard. Keep in mind, this does mean that you’ll want to take extra care with your cable routing, as it’ll all be on show, and even more so if you’ve got lighting in your build.

the front panel is tempered glass too, showing off the metal work detail behind it, although because of this metal behind it, it’s also a lot more mirror like and harder to capture with my camera, but we’ll see it better from the interior.

The brushed aluminium panel at the top houses the USB 2.0 ports, HD audio jacks, a single USB 3.0 and a USB 3.1 Type-C connector. There’s also a pair of indicator LEDs and the power button here.

The In Win logo is behind the glass, not printed on it, a nice yet rather subtle touch.

Things look pretty standard around the back, with a large fan grille at the top for the rear 120mm fan, eight expansion slots with reusable covers and the PSU cut-out.

The top panel is a single piece of black brushed aluminium.

On the base, we’ve got two full-width plastic feet with rubber grips, these provide a nice stand but also improved ground clearance for the bottom dust filter.

This dust filter provides clean passive airflow, but also covers the mounts for two optional 120mm fans.

Qualcomm Announces Snapdragon 808 and 810 Processors

Qualcomm certainly isn’t wasting any time.

Now that the Snapdragon 801 processor is being pushed out into the wild via phones like the HTC M8 and the Samsung Galaxy S5, it’s only fitting that they announce their next generation line. According to Qualcomm these new chips are looking at a Q1/Q2 2015 release time frame which makes sense since we will most likely see Snapdragon 805 equipped devices released in late summer.

These new chips are the first high end processors to be based on 64-bit architecture which is obviously the ammo needed to battle Apple since they had released their own 64-bit processing in the iPhone 5s. The low end will be covered by the recently announced Snapdragon 410, 610, and 615. With native 4k Ultra HD interface and video capturing support baked in its looking to be a beast of a SoC. With an upgraded camera suite using gyro-stabilization and 3D noise reduction for producing high quality 4K video at 30 frames per second and 1080p video at 120 frames per second, there’s no doubt that it will lead the next generation of mobile devices. There’s also a combined 14-bit dual Image Signal Processors (ISPs) capable of supporting 1.2GP/s throughput and image sensors up to 55MP. With the current crop of high end devices capping out at around 20mp (excluding the Lumia 1020 of course) this will help mobile devices cut deeper and deeper into the Point and Shoot camera market in the future.

The real meat of these processors is from combining Cortex-A53 cores and the more powerful Cortex-A57s. The A57 is supposed to be bringing a 50% increase in performance over the current A15s. Memory will be  supported by advanced DDR4 along with other bonuses like Cat 6 LTE-Advanced speed of up to 300 Mbps as well as enhanced carrier aggregation

Saving the best news for last is that with new processors comes better graphical processing as well. The Snapdragon 808 will come packed with an Adreno 418. According to the San Diego chip manufacturer this gpu will be about 20% faster than Adreno 330. The 810 processor will be armed with Adreno 430, which is roughly about 30% faster which will most likely only marginally surpass that of the Adreno 420 paired with the 805.

 

Thanks to Qualcomm for providing us with this information.

New Qualcomm Snapdragon 805 CPU To Support For 4K Video

Qualcomm has announced its new high-end processor, the Snapdragon 800. Besides the current Snapdragon 800, the 805 rises the stakes in terms of both graphical and computational capabilities. The new processor includes a quad-core Krait 450 CPU with speeds of up to 2.5GHz and memory bandwidth of up to 25.6 GB/second, compared to 14.9 GB/s on the current Snapdragon 800.

The new Adreno 420 GPU has a 40% graphical performance increase and enabling 4K displays on devices as well as the ability to drive Ultra HD content on an external display over a wireless connection. Other highlights for the new GPU include hardware tessellation and geometry shaders, features typically found on high-end PC graphics cards, and hardware 4K HEVC (H.265) decoding for more efficient video playback.

Qualcomm also comes with new tricks for gigapixel-per-second throughput for cameras, along with new low-power sensor processing tricks it says will enable “a wide range of sensor-enabled mobile experiences.”

Qualcomm is said to integrate the new chips in devices as early as Q1 2014, which leads to the conclusion that there is a possibility of it being seen at CES 2014 in Las Vegas next January.

Thank you Android Central for providing us with this information