Ever since HBM1 was revealed and launched with Fury X, many have been looking forwards to what HBM2 would bring along in 2016. While HBM1 brought large power savings and a major boost in memory bandwidth, it was largely limited to a relatively low 4GB capacity. HBM2, however, is set to provide a boost in capacity and bandwidth by increasing the number of stackable dies. We’re now getting reports that AMD’s upcoming Polaris chips will utilize HBM2.
As a major revamp of the GCN architecture, a Polaris flagship GPU would be the natural product to debut HBM2. A flagship GPU much more powerful than current generation chips due to the new architecture and process node would likely require more memory bandwidth to feed it and a high memory capacity as it would be meant for VR and 4K gaming. Being the largest chip in the lineup, the flagship would also benefit from the major power savings, helping offset its core power consumption. The confirmation of HBM2 also suggests that we will be getting high-end Polaris chips this year.
At the same time, AMD is also confirming that they will continue to use GDDR5 and likely GDDR5X as well. At CES, AMD showed off a low powered Polaris chip using GDDR5 that was able to provide the same performance as Nvidia’s GTX 950 but with a significantly lower power consumption. With such a leap in efficiency, the HBM2 chips will likely be light years ahead of current cards in terms of efficiency if GDDR5 already shows such massive gains.