Despite launching earlier this month, AMD has been suffering from low stocks of their new R9 Fury and Fury X GPUs. In many cases, the cards have sold out quickly, meaning many of those looking to go with the red team have been turned away. In an effort to get ahead of demand, it looks like AMD to turning to more sources to get Through Silicon Vias (TSV).
As we all know, AMD uses a silicon interposer to connect the HBM DRAM stack to the GPU die. In order to connect all three parts together, Through Silicon Vias are required, which is an extra step that is not normally required. While there was speculation that AMD was doing this either with Hynix or TSMC, the more likely solution, as we now know, is to get a third-party silicon fab to handle it, in this case, United Microelectronics Corporation. UMC is producing the silicon interposer that the HBM and GPU die are placed, and that is also going into volume production.
It seems that AMD was a bit premature in launching their Fiji lineup with the critical part still in limited production. With the silicon interposer now in full production, the bottleneck to Hynix or TSMC, helping improve the supply situation. Given that it will take some time for the completed dies to be shipped to AIBs and then sent to retailers, it still be may some time till the R9 Fury and Fury X are fully in stock. Hopefully, AMD’s upcoming R9 Fury Nano will arrive in a much better supply situation.